НИИ ФХП БГУ

Research Institute for Physical Chemical Problems
of the Belarusian State University

Technology of Conductive Pattern Plating on Photochemically Activated Polymer Substrates



Технология осаждения из растворов токопроводящих рисунков
на активированных фотохимическим путем полимерных подложках



phone: +375 (17) 209-51-79
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Objective:
The technology can be used for selective plating of conductive copper, nickel and other metal patterns on dielectrics that do not contain metal foils, without the usage of photolithographyApplication:
  • The technology and solutions can be used for:
  • production of flexible and hard printed circuit boardsincluding conductive through-hole connections, cables and apron–plates
  •  production of multilayer printed boards andhigh density boards
  • waveguidesmanufacturing
  • production of heating elements (for irons, windscreens of automobiles)
 Technical characteristics:
  • nature of dielectric substrate: polyimide, polyethylene terephthalate, polyamide, sitalles etc.
  • nature of conductive metal: copper, nickel, tin, gold
  • required thickness of conductors is provided by the electroless plating from solutions of copper or nickel (up to 0,2 µm) and subsequent electrochemical deposition of copper (up to 25–35 µm) or electroless nickel plating (up to 12 µm)
  • subsequent deposition of other metals and alloys (for example, gold, Sn-Pb alloy) is possible
  • minimum sizes of elements are 10–20 µm at conductor thickness 0,2–5 µm and 40–100 µm at the thickness 10–25 µm
  • minimum diameter of metallized holes is 40 µm at dielectric thickness of 40 µm
  • adhesion strength of conductive elements to a substrate is 500–800 N/m
  • resistance is determined by the nature of dielectric (in case of polyimide it reaches 104 MOhm)

· the flexible substrate (polyimide) can be bent more than 6000 times (at a bend diameter of 6 mm) before the copper conductors start to crack

Advantages:

  • double decrease inlabour and materials' costs relative to semiadditive technology of printed boards
  • various typesof the deposited metal (copper, nickel, tin, gold etc.)
  • various thickness levelsof coating from 0.1–35 µm and above
  • production of small size conductive elements, starting from 10 µm
  • production of electrically disconnected elements
  • production of dielectrics of different chemical nature without metal foils

 

Implementation:
The technology is implemented at the industrial associations in Minsk, Belarus, and in Russia

Forms of cooperation:
  • sale of the technology
  • manufacturing of items toorder
  • sale of the know–how
  • joint venture
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